Pay in 4 interest-free payments of $8.50 Learn more
Shipping Estimate
USA
- USA
- CAN
- USA
- CAN
Ships within 48 hours · Estimated delivery Sep 1 - Sep 6
Pay in 4 interest-free payments of $8.50 Learn more
Ships within 48 hours · Estimated delivery Sep 1 - Sep 6
Handle Line Length: about 1
Fahrenheit ℉)
- S35C-13mini Screen transfer test cable
Connect the iPhone to be repaired to i2C Assistant to flash the phone and unbind the factory code
JTX Swap Board CPU Chip Reballing Platform for iPhone 8-16 Pro Max Machine vision camera Handle Line Length: about 1JTX SM 01 Swap Master 30 in 1 Tinning Platform with BGA stencil for iPhone 8 16 Pro Max motherboard replacement and CPU BGA chip reballing. Super Magnetic Positioning Tinning Platform for iPhone PCB board swapping chips rapid positioning, allows for reballing of multiple chip sizes at once, and the strong magnetism aids the reballing process, ensuring optimal solder component placement. Option: 1. SM 01: For iPhone 8 8P X Qualcomm. 2. SM 02: For